Coordinate measuring device (CMM), one of the measuring devices for reverse engineering that requires constant environmental and environmental conditions. This change of conditions may be unavoidable due to the need of the industry to enter the devices into the workshop environment, and changes are applied to the device structures. This change causes non-uniform deformation and distortion of the structure as well as the code rulers of the device, which affects the measurement results. In this research, in order to investigate the effect of changing environmental conditions on the CMM device and investigate the errors caused by it, the three-dimensional model of the CMM device was designed in ANSYS finite element software and by applying the difference between the ambient temperature and the temperature of the structure, the unstable thermal analysis of the device was performed. has been The overall shape of the structure and the rulers have been changed. For the purpose of validation, the results obtained from the amount of displacement of the rulers and the building of the structure have been compared with the existing analytical relationships, and a very acceptable match is observed. Also, the analysis of deformations and general distortion of the structure has resulted in results regarding the improvement of the design and materials used in the structure.